Custom BGA And VFBGA 1.6mm Thickness Multilayer PCB With Immersion Gold Rigao02430 manufacturer from China Shenzhen Rigao Electronics Co., LTD

Custom BGA And VFBGA 1.6mm Thickness Multilayer PCB With Immersion Gold

Place of Origin:

Guangdong, China (Mainland)


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Product Detail

Model No.: Rigao02430

Cust

Custom BGA And VFBGA 1.6mm Thickness Multilayer PCB With Immersion Gold

Specifications

1, No MOQ;
2, OEM SMT&DIP Service;
3, 1-22 Layer;
4, UL.ROSH SGS Certification;
5, High quality, low cost&fast delivery.

Welcome to Rigao Electronics .CO.,Ltd.

Single-side,double-sided and multilayer PCB and PCB Assembly manufacturer/OEM

- Contract Manufacturing

- Mixed-technology (High speed SMT & Through hole assembly)

- PCB Design & Assembly and copy service

- Prototyping

- Components purchasing

- Metal box,Coil,Cable and Wire Assemblies

- Plastics and Molds

PCB Assembly Specifications
PCB Assembly Specifications
Quantity	Prototype and small to middle volume are our specialty
Type of Assembly	SMT and Thru-hole
Type of Service	Turn-Key, Partial Turn-Key or Consignment
Solder Type	Water Soluble Solder Paste, Leaded and Lead-Free
File Formats	Bill of Materials
	Gerber Files
	Pick-N-Place File (XYRS)
Bare Board Size	Smallest: 0.25 x 0.25 Inches
Bare Board Size	Largest: 20 x 20 Inches
Components	Passives Down to 0201 Size
	BGA and VFBGA
	Leadless Chip Carriers/ CSP
	Double-Sided SMT Assembly
	BGA Repair and Reball
	Part Removal and Replacement
Component Packaging	Cut Tape,Tube,Reels,Loose Parts
Turn Time	Same Day Service to 15 day service
Testing	X-RAY Inspection & AOI Test

PCB Assembly Technical Capability

We deliver high quality surface-mount technology (SMT) products through the use of modern, well maintained SMT lines that are operated by trained professionals. Our SMT lines are capable of handling both low and high volume through-put, can perform single and double sided component placement, mixture of SMT automatic and manual component assemblies, SMT and through-hole assemblies.

Capability   1.SMT with 4 million placements per day
                   2.Manual insertion with output 500,000pcs components per day
                   3.Chip mounting speed is 0.3S/unit,high-point speed is 0.16S/unit

Mount Precision: 1.Chips size:Min.0201
2.Mounting precision:0.1mm
3.Multi-functional machine can match 0.3 pitch packages such as BGA,CSP